HFA1205IP(1998) Просмотр технического описания (PDF) - Intersil
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HFA1205IP Datasheet PDF : 7 Pages
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Die Characteristics
DIE DIMENSIONS:
69 mils x 92 mils x 19 mils
1750µm x 2330µm x 483µm
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layout
HFA1205
SUBSTRATE POTENTIAL (Powered Up):
Floating (Recommend Connection to V-)
PASSIVATION:
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
TRANSISTOR COUNT:
180
HFA1205
-IN1
OUT1 NC
NC
+IN1
NC
NC
V-
V+
OUT2
-IN2
NC
NC
+IN2
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