BC858CE6327 Просмотр технического описания (PDF) - Infineon Technologies

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Компоненты Описание

Список матч

BC858CE6327

PNP Silicon AF Transistor

Infineon Technologies 

Package TSLP-3-1

BC857...-BC860...

Package Outline

3

1

2

Top view

0.4 +0.1

0.05 MAX.

Bottom view

0.6 ±0.05

0.5 ±0.0351)

3

Pin 1

marking

2

1

0.35 ±0.05

2 x 0.15 ±0.0351)

1) Dimension applies to plated terminal

Foot Print

For board assembly information please refer to Infineon website "Packages"

0.6

0.45

0.225

0.15

0.225

Copper Solder mask

Marking Layout (Example)

0.2

R0.1

0.2

0.17

Stencil apertures

BFR193L3

Type code

Pin 1 marking

Laser marking

Standard Packing

Reel ø180 mm = 15.000 Pieces/Reel

4

0.5

Pin 1

marking

0.76

10

2011-09-19

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