HMC130(V02) Просмотр технического описания (PDF) - Hittite Microwave

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HMC130
(Rev.:V02)

GaAs MMIC DOUBLE-BALANCED MIXER, 6 - 11 GHz

Hittite Microwave 

v02.0802

MICROWAVE CORPORATION

HMC130

GaAs MMIC DOUBLE-BALANCED

MIXER, 6 - 11 GHz

Outline Drawing

5

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. BOND PADS ARE .004” SQUARE

3. TYPICAL BOND PAD SPACING CENTER TO CENTER

IS .006” EXCEPT AS SHOWN

4. DIE THICKNESS = .004” [.100 MM]

5. BACKSIDE METALIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. BOND PAD METALIZATION: GOLD

Pad Descriptions

Pad Number

Function

1

LO

Description

This pin is DC coupled and matched to 50 Ohm

from 6 to 11 GHz.

This pin is DC coupled. For applications not requiring opera-

tion to DC, this port should be DC blocked externally using a

2

IF

series capacitor whose value has been chosen to pass the

necessary IF frequency range. For operation to DC this pin

must not source or sink more than 2mA of current or die non-

function and possible die failure will result.

3

RF

This pin is DC coupled and matched to 50 Ohm

from 6 to 11 GHz.

Interface Schematic

GND

The backside of the die must connect to RF ground.

5 - 18

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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

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