XS1000 Просмотр технического описания (PDF) - Unspecified
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XS1000 Datasheet PDF : 6 Pages
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7.0-13.0 GHz GaAs MMIC
6-Bit Phase Shifter
October 2006 - Rev 17-Oct-06
Mechanical Drawing
2.104
(0.828)
0.998 1.398 1.798
(0.393) (0.550) (0.708)
0.798 1.198 1.598 1.998
(0.314) (0.472) (0.629) (0.787)
234 5678
1.267
(0.499)
1
S1000
9
1.267
(0.499)
0.0
0.0
2.973
(Note: Engineering designator is I0005360)
(1.171)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.88 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Input 1)
Bond Pad #3 (Input 2)
Bond Pad #4 (Input 3)
Bond Pad #5 (Vss)
Bond Pad #6 (Input 4)
Bond Pad #7 (Input 5)
Bond Pad #8 (Input 6)
Bond Pad #9 (RF Out)
Bias Arrangement
Bypass Capacitors - See App Note [2]
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 6
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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