XE5690SM-1 Просмотр технического описания (PDF) - Xecom

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XE5690SM-1

Compact, Low-Cost Global Embedded Modem

Xecom 

XE5690SM-1 Surface-Mount Soldering Instructions

The XE5690SM-1 is subject to damage if over-exposed to heat during solder reflow operations.

Following the soldering instructions below will ensure that the process of soldering the module to the

board does not damage the modem.

Maximum Temperature

Maximum Time at 220O C

Maximum Time above Eutectic (180O C)

Maximum Preheat Dwell Time

220O C

20 Seconds

90 Seconds

180 Seconds

Maximum Recommended Solder Temperature Profile

220O C

180O C

150O C

------------------------------180 sec max-------------------------

-20 sec-

max

----- 90 sec max -----

XECOM

(7)

XE5690SM

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