datasheetbank_Logo
Технический паспорт Поисковая и бесплатно техническое описание Скачать

XC6221A451NR-G Просмотр технического описания (PDF) - TOREX SEMICONDUCTOR

Номер в каталоге
Компоненты Описание
Список матч
XC6221A451NR-G Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
PACKAGING INFORMATION (Continued)
SSOT-24 Power Dissipation
Power dissipation data for the SSOT-24 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
XC6221
Series
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40×40mm1600mm2 in one side
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material : Glass EpoxyFR-4
Thickness : 1.6mm
Through-hole : 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125)
Ambient Temperature ()
25
85
Power Dissipation Pd (mW)
500
200
Thermal Resistance (/W
200.00
600
500
400
300
200
100
0
25
Pd vs Ta
45
65
85
105
125
Ambient Temperature Ta(℃)
23/28

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]