25X40BLSIG Просмотр технического описания (PDF) - Winbond

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Компоненты Описание

Список матч

25X40BLSIG

1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

Winbond 

W25X10BL/20BL/40BL

11.2 8-Pin SOIC 208-mil (Package Code SS)

SYMBOL

A

A1

A2

b

C

D

D1

E

E1

e

H

L

y

θ

MILLIMETERS

MIN NOM MAX

1.75

0.05

1.70

0.35

0.19

5.18

5.13

5.18

5.13

7.70

0.50

-

0°

1.95

0.15

1.80

0.42

0.20

5.28

5.23

5.28

5.23

1.27 BSC

7.90

0.65

-

-

2.16

0.25

1.91

0.48

0.25

5.38

5.33

5.38

5.33

8.10

0.80

0.010

8°

MIN

0.069

0.002

0.067

0.014

0.007

0.204

0.202

0.204

0.202

0.303

0.020

-

0°

INCHES

NOM

0.077

0.006

0.071

0.017

0.008

0.208

0.206

0.208

0.206

0.050 BSC

0.311

0.026

-

-

MAX

0.085

0.010

0.075

0.019

0.010

0.212

0.210

0.212

0.210

0.319

0.031

0.004

8°

Notes:

1. Controlling dimensions: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.

- 47 -

Publication Release Date: October 14, 2009

Preliminary -- Revision A

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