25X16BVAIG Просмотр технического описания (PDF) - Winbond

Номер в каталоге

Компоненты Описание

Список матч

25X16BVAIG

16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

Winbond 

8-Pad WSON 6x5mm Cont’d.

W25X16BV

SYMBOL

MILLIMETERS

MIN

TYP.

MAX

SOLDER PATTERN

M

3.40

N

4.30

P

6.00

Q

0.50

R

0.75

INCHES

MIN

TYP.

MAX

0.1338

0.1692

0.2360

0.0196

0.0255

Notes:

1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of

exposed PCB vias under the pad.

- 43 -

Publication Release Date: October 7, 2009

Preliminary -- Revision C

Share Link: