25X15ALFIG Просмотр технического описания (PDF) - Winbond

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25X15ALFIG

16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

Winbond 

W25X16, W25X16A, W25X32, W25X64

14.2 8-Pin SOIC 208-mil (Package Code SS)

SYMBOL

A

A1

A2

b

C

D

E

E1

e

L

θ

y

MILLIMETERS

MIN

MAX

1.75

2.16

0.05

0.25

1.70

1.91

0.35

0.48

0.19

0.25

5.18

5.38

7.70

8.10

5.18

5.38

1.27 BSC

0.50

0.80

0o

8o

---

0.10

INCHES

MIN

MAX

0.069 0.085

0.002

0.067

0.010

0.075

0.014 0.019

0.007 0.010

0.204 0.212

0.303

0.204

0.319

0.212

0.050 BSC

0.020 0.031

0o

8o

---

0.004

Notes:

1. Controlling dimensions: inches, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the

package.

4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.

- 41 -

Publication Release Date: may 5, 2008

Revision I

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