W215B Просмотр технического описания (PDF) - Cypress Semiconductor
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W215B Datasheet PDF : 13 Pages
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Package Diagram
PRELIMINARY
48-Pin Small Shrink Outline Package (TSSOP, 6.1 mm)
W215B
8
E
7
6
4
B
1.0 0
32 1
1.00 DIA. 0D.E0E0 P
0 .0 5
E/ 2
1 .0 0
E8
H/2
H
5
4
C
12 3
CL
3
2
REV .
DE SCRI PTI ON
00
INITIAL RELEASE PER DCN# D24479.
01
INITIAL RELEASE PER DCN# D24860.
1
DAT E
1 0/23
1996
0 3/18
1997
O RIGI NATO R
D.T.R.
D.T.R. E
0.20 H A-B D
D
0.20 C A-B D
N
7
A4
D
4
N
SEE
DETAIL "A"
D
e /2
X X = A AND B
X X = A AND B
TOP VIEW
END VIEW
BOTTOM VIEW
EVEN LEAD SIDES
ODD LEAD SIDES
TOPVIEW
TOPVIEW
SEE DETAIL 'B'
C
b
bbb M C A-B D 9
A2
0.05 C
A
C
H
3
e
D5
C
aa a
8
A1
SEATING
P LA N E
SIDE VIEW
B
b
b1
C
WITH PLATING
c1
c
BASE METAL
B
SECTION "C-C"
SCALE: 120/1
(SEE NO TE 10)
0.2 5
P A RTIN G
LI NE
DECIMAL ANGULAR PROJECTION
Anam Industrial Co., LTD.
Seoul, Korea
Amk or/Anam Pilipinas, INC.
Manila, Philippines
EXCELLENCE IN SEMICONDUCTOR
XX±
±
H
SEATING PLANE
XXX±
Amk or Elec tronics
Irving, TX
TI TLE
Amk or Elec tronics
Chandler, AZ
ASSEMBLY AND TEST
A
C
L6
( O)C
XXXX±
C
M ATE RIA L
DRAWN
AP PRO VA L S
G. KAYLOR
DATE
02 /28
1 996
PACKAGE OUTLINE,
A
6.10mm BODY, TSSOP, AAWW
DETAIL "B"
CHECK ED
02/ 28
M. CARTER
1 996
S IZE
DWG. NO.
REV .
DETAIL 'A'
(SCALE: 30/1)
(SCALE: 30/1)
DAMBAR PROTRUSION
FINIS H
DO NOT SCALE DRAWING
ENG 'R
D. ROMAN
REL EA S ED
T. LLORENTE
10/ 23
1 996
10/ 23
1 996
A1
S CAL E
8/1
38119
S HEE T
01
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8
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© Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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