µPD72874
7. RECOMMENDED SOLDERING CONDITIONS
The µPD72874 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 7-1. Surface Mounting Type Soldering Conditions
µPD72874GC-YEB: 120-pin plastic TQFP (Fine pitch) (14 x 14)
Soldering
Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).
Count: three times or less
Exposure limit: 3 daysNote (after that prebake at 125°C for 10 hours)
IR35-103-3
Partial heating Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)
—
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Preliminary Data Sheet S15306EJ2V0DS
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