UPC1909 Просмотр технического описания (PDF) - NEC => Renesas Technology

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UPC1909

SWITCHING REGULATOR CONTROL IC

NEC => Renesas Technology 

µPC1909

RECOMMENDED SOLDERING CONDITIONS

The µPC1909 should be soldered and mounted under the following recommended conditions. For the details of

the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology

Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC

sales representative.

Insertion Type

µPC1909CX: 16-pin plastic DIP (300 mils)

Soldering Method

Wave soldering (pins only)

Partial heating

Soldering Conditions

Solder bath temperature: 260°C Max., Time: 10 seconds max.

Pin temperature: 300°C max., Time: 3 seconds max. (per pin)

Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with

the package.

Surface Mounting Type

µPC1909GS: 16-pin plastic SOP (300 mils)

Soldering Method

Infrared reflow

VPS

Wave soldering

Soldering Conditions

Package peak temperature: 235°C, Time: 30 seconds max.

(at 210°C or higher), Count: Twice or less

Package peak temperature: 215°C, Time: 40 seconds max.

(at 200°C or higher), Count: Twice or less

Soldering bath temperature: 260°C or less, Time: 10 seconds max.,

Count: Once, Preheating temperature: 120°C MAX.

(package surface temperature)

Recommended

Condition symbol

IR35-00-2

VP15-00-2

WS60-00-1

Caution Do not use different soldering methods together.

12

Data Sheet G14309EJ1V0DS00

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