UDA1338H Просмотр технического описания (PDF) - Philips Electronics

Номер в каталоге

Компоненты Описание

Список матч

UDA1338H

Multichannel audio coder-decoder

Philips Electronics 

Philips Semiconductors

Multichannel audio coder-decoder

Preliminary specification

UDA1338H

CONTENTS

1

1.1

1.2

1.3

1.4

2

3

4

5

6

7

8

8.1

8.2

8.3

8.4

8.5

8.6

8.7

8.8

8.9

8.10

8.11

8.12

8.13

8.14

9

9.1

9.2

9.3

9.4

9.5

10

10.1

10.2

10.3

10.4

10.5

10.6

10.7

10.8

10.9

10.10

10.11

10.12

FEATURES

General

Multiple format data interface

Digital sound processing

Advanced audio configuration

APPLICATIONS

GENERAL DESCRIPTION

ORDERING INFORMATION

QUICK REFERENCE DATA

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

System clock

Audio analog-to-digital converter (audio ADC)

Voice analog-to-digital converter (voice ADC)

Decimation filter of audio ADC

Decimation filter of voice ADC

Interpolation filter of DAC

Noise shaper of DAC

Digital mixer

Audio digital-to-analog converters

Power-on reset

Audio digital interface

Voice digital interface

DSD mode

Microcontroller interface mode

L3-BUS INTERFACE

General

Device addressing

Register addressing

Data write mode

Data read mode

I2C-BUS INTERFACE

General

Characteristics of the I2C-bus

Bit transfer

Byte transfer

Data transfer

Start and stop conditions

Acknowledgment

Device address

Register address

Write and read data

Write cycle

Read cycle

11

11.1

11.2

11.3

11.4

11.5

11.6

11.7

11.8

11.9

11.10

11.11

11.12

11.13

11.14

12

13

14

15

16

17

18

19

20

20.1

20.2

20.3

20.4

20.5

21

22

23

24

REGISTER MAPPING

Address mapping

Register mapping

System settings

Audio ADC and DAC subsystem settings

Voice ADC system settings

Status output register (read only)

DAC channel selection

DAC features settings

DAC channel 1 to 6 settings

DAC mixing channel settings

Audio ADC 1 and ADC 2 input amplifier gain

settings

Voice ADC gain settings

Supplemental settings 1

Supplemental settings 2

LIMITING VALUES

HANDLING

QUALITY SPECIFICATION

THERMAL CHARACTERISTICS

DC CHARACTERISTICS

AC CHARACTERISTICS

TIMING

PACKAGE OUTLINE

SOLDERING

Introduction to soldering surface mount

packages

Reflow soldering

Wave soldering

Manual soldering

Suitability of surface mount IC packages for

wave and reflow soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PURCHASE OF PHILIPS I2C COMPONENTS

2002 Nov 21

2

Share Link: