TZA3047B Просмотр технического описания (PDF) - Philips Electronics
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TZA3047B Datasheet PDF : 28 Pages
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Philips Semiconductors
30 Mbits/s up to 1.25 Gbits/s laser drivers
Product specification
TZA3047A; TZA3047B
8 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to ground; positive
currents flow into the IC.
SYMBOL
PARAMETER
CONDITION
MIN.
VCCD
VCCA
VCCO
digital supply voltage
analog supply voltage
output stage supply voltage
−0.5
−0.5
3.3 V laser supply
−0.5
5 V laser supply (TZA3047B only) −0.5
Vo(LA)
output voltage at pin LA
TZA3047A; VCCO = 3.3 V
1.2
TZA3047B; VCCO = 3.3 V
0.8
TZA3047B; VCCO = 5 V
1.2
Vo(LAQ) output voltage at pin LAQ
TZA3047A; VCCO = 3.3 V
1.8
TZA3047B; VCCO = 3.3 V
1.6
TZA3047B; VCCO = 5 V
2.0
VBIAS
bias voltage
TZA3047A; VCCO = 3.3 V
0.4
TZA3047B; VCCO = 3.3 V
0.4
TZA3047B; VCCO = 5 V
0.8
Vn
voltage on other input and output
pins
analog inputs and outputs
−0.5
digital inputs and outputs
−0.5
In
input current on pins
MAXOP, MAXMON, RREF, PWA,
−1.0
ER and AVR
VTEMP, BIASOUT and MODOUT
−1.0
ALOP, ALMON and MON
0
Tamb
ambient temperature
−40
Tj
junction temperature
−40
Tstg
storage temperature
−65
MAX.
+3.5
+3.5
+3.5
+5.3
4.5
4.1
4.5
4.5
4.5
5.2
3.6
3.6
4.1
VCCA + 0.5
VCCD + 0.5
0
+1.0
5.0
+85
+125
+150
UNIT
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
mA
mA
mA
°C
°C
°C
9 THERMAL CHARACTERISTICS
In compliance with JEDEC standards JESD51-5 and JESD51-7.
SYMBOL
PARAMETER
CONDITIONS
Rth(j-a)
thermal resistance from junction to
ambient
4 layer printed circuit board in still
air with 9 plated vias connected
with the heatsink and the first
ground plane in the PCB
HBCC32 die pad soldered to
PCB
VALUE
35
60
UNIT
K/W
K/W
2003 Jun 05
9
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