TGA4508 Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGA4508 Datasheet PDF : 11 Pages
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Chip Assembly Diagram
TGA4508
Vg
Vd
RF In
0.01 uF
0.01 uF
100 pF
100 pF
RF Out
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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