TGA1172 Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGA1172 Datasheet PDF : 4 Pages
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Advance Product Information
March 21, 2000
TGA1172
Vd
5mil
Ribbon
100pF
0.01µF
5mil
Ribbon
100pF
0.01µF
Vg
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
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