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TEA6848H

New In Car Entertainment car radio tuner IC with Precision Adjacent Channel Suppression (NICE-PACS)

Philips Electronics 

Philips Semiconductors

New In Car Entertainment car radio tuner IC with

Precision Adjacent Channel Suppression (NICE-PACS)

Product specification

TEA6848H

CONTENTS

1

2

3

4

5

6

7

7.1

7.1.1

7.1.2

7.1.3

7.2

7.3

7.3.1

7.3.2

7.3.3

7.3.4

7.3.5

7.3.6

7.3.7

7.3.8

7.3.9

7.3.10

7.4

7.4.1

7.4.2

7.4.3

7.4.4

7.5

7.6

7.7

8

9

10

11

FEATURES

GENERAL DESCRIPTION

ORDERING INFORMATION

QUICK REFERENCE DATA

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

Oscillators

VCO

PLL

Crystal oscillator

DAA

FM signal channel

FM mixer 1

Buffer output for weather band flag

(pin WBFLAG)

FM keyed AGC

FM IF amplifier

FM mixer 2

FM IF2 dynamic selectivity

FM quadrature demodulator

Adjacent channel detector and threshold

extension

Bandwidth control ‘active’ flag (pin IFBWFLAG)

Bandwidth control monitor voltage (pin VIFBW)

AM signal channel

AM tuner including mixer 1 and mixer 2

AM RF AGC

AM detector

AM noise blanker

FM and AM level detector

IF2 filter gain alignment

Frequency offset detector/alignment

LIMITING VALUES

THERMAL CHARACTERISTICS

DC CHARACTERISTICS

AC CHARACTERISTICS

12

12.1

12.1.1

12.1.2

12.1.3

12.1.4

12.1.5

12.2

12.2.1

12.2.2

12.2.3

12.2.4

12.2.5

12.2.6

12.2.7

12.2.8

12.2.9

12.2.10

13

14

15

16

16.1

16.2

16.3

16.4

16.5

17

18

19

20

I2C-BUS PROTOCOL

I2C-bus specification

Data transfer

I2C-bus pull-up resistors

Frequency setting

Default settings

Timing requirements

I2C-bus protocol

Data transfer mode and IC address

Write mode: data byte 0

Write mode: data byte 1

Write mode: data byte 2

Write mode: data byte 3

Write mode: data byte 4

Write mode: data byte 5

Write mode: data byte 6

Write mode: data byte 7

Read mode: data byte 0

TEST AND APPLICATION INFORMATION

INTERNAL CIRCUITRY

PACKAGE OUTLINE

SOLDERING

Introduction to soldering surface mount

packages

Reflow soldering

Wave soldering

Manual soldering

Suitability of surface mount IC packages for

wave and reflow soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PURCHASE OF PHILIPS I2C COMPONENTS

2004 Nov 12

2

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