ISP1563 Просмотр технического описания (PDF) - Infineon Technologies
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ISP1563 Datasheet PDF : 36 Pages
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TDK5116F
Applications
3.3
Bill of Material (50 Ohm-Output Evalboard)
Reference
R1
R2
R3
R4
R5
R6
R7
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
L1
L2
X1
X2
X3
X4
X5
X6
X7
JP1
JP2
Q1
IC1
Value
open
open
4k7
12k
open
15k
open
8p2
15p
open
47n
100p
6p8
47p
47p
2p7
47n
10n
82n
n.e.
n.e.
Pin
Pin
SMA-connector
SMA-connector
n.e.
solder bridge
solder bridge
13.56875 MHz, CL=12pF
TDK5116F
Specification
0603, +/-5%
0603, +/-5%
0603, +/-5%
0603, C0G, +/-1%
0603, C0G, +/-0.1p
0603, X7R, +/-10%
0603, X7R, +/-10%
0603, C0G, +/-1%
0603, C0G, +/-1%
0603, C0G, +/-5%
0603, C0G, +/-0,1p
0603, X7R, +/-10%
EPCOS SIMID 0603-C, +/-2%
EPCOS SIMID 0603-C, +/-2%
single-pole connector, 2.54mm
single-pole connector, 2.54mm
in position “XTAL”
in position “FSK”
Tokyo Denpa TSS-3B, Spec.No. 10-50205
PCB
TDK5116F V1.0
Manufacturer: PIU Printex in Vienna
Data Sheet
21
V 1.1, 2006-09-15
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