T7023 Просмотр технического описания (PDF) - Atmel Corporation

Номер в каталоге

Компоненты Описание

Список матч

T7023

ISM/Bluetooth™ 2.4-GHz Power Amplifier

Atmel Corporation 

Figure 15. Application Board Layout

0R

1.5pF

5.6pF

15pF

1nF1µF

3.3pF

hQ

15pF1nF1µF

56pF

1.5pF hQ

15nH hQ

5.6pF hQ

10pF1nF1µF

Gerberfiles are available on request.

The application board consists of 4 layers:

1. top layer: RF-signals, 35 µm Cu

2. spacing: 490 µm FR4

3. second layer: GND, 35 µm Cu

4. spacing: 550 µm FR4

5. third layer: GND (optional), 35 µm Cu

6. spacing: 490 µm FR4

7. bottom layer: DC connection, 35 µm Cu

10 T7023

4532A–BLURF–09/02

Share Link: