STV7733 Просмотр технического описания (PDF) - STMicroelectronics
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STV7733 Datasheet PDF : 28 Pages
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Pad dimensions (in microns)/pad positions
11 Pad dimensions (in microns)/pad positions
STV7733
The reference (x=0, y=0) is the center of the die. Bump pad pitch: 68µm, minimum (on the
power output side of the die).
Table 8. Die size
Dimension
Units
Die size without scribe
X
22440
µm
Y
1550
µm
Die size with scribe
X
22550
µm
Y
1660
µm
Pad placement coordinate values correspond to the center of each bump pad center.
Number of pads: 404
Table 9. Pad placement and bump dimensions (in microns)
Lead pad name
Pad placements
X
Y
Bump dimensions(1)
X
Y
OUT320
OUT319
OUT318
OUT317
-10845.9
600.6
51.0
73.1
-10777.9
600.6
51.0
73.1
-10709.9
600.6
51.0
73.1
-10641.9
600.6
51.0
73.1
OUT316
OUT315
OUT314
OUT313
-10573.9
600.6
51.0
73.1
-10505.9
600.6
51.0
73.1
-10437.9
600.6
51.0
73.1
-10369.9
600.6
51.0
73.1
OUT312
OUT311
OUT310
OUT309
OUT308
-10301.9
600.6
51.0
73.1
-10233.9
600.6
51.0
73.1
-10165.9
600.6
51.0
73.1
-10097.9
600.6
51.0
73.1
-10029.9
600.6
51.0
73.1
OUT307
OUT306
OUT305
OUT304
-9961.9
600.6
51.0
73.1
-9893.9
600.6
51.0
73.1
-9825.9
600.6
51.0
73.1
-9757.9
600.6
51.0
73.1
OUT303
-9689.9
600.6
51.0
73.1
14/28
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