STTH802 Просмотр технического описания (PDF) - STMicroelectronics

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STTH802

Ultrafast recovery diode

STMicroelectronics 

STTH802

Package information

Table 8. D2PAK dimensions

Dimensions

Ref.

Millimeters

Inches

Min.

Max.

Min.

Max.

E

L2

A

C2

A

4.40

A1 2.49

A2 0.03

4.60 0.173 0.181

2.69 0.098 0.106

0.23 0.001 0.009

B

0.70

0.93 0.027 0.037

D

B2 1.14

1.70 0.045 0.067

L

L3

A1

C 0.45

C2 1.23

0.60 0.017 0.024

1.36 0.048 0.054

B2

B

C

R

D 8.95

9.35 0.352 0.368

G

E 10.00 10.40 0.393 0.409

A2

G 4.88

5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

M*

V2

L2 1.27

* FLAT ZONE NO LESS THAN 2mm

L3

1.40

M 2.40

1.40 0.050 0.055

1.75 0.055 0.069

3.20 0.094 0.126

R

0.40 typ.

0.016 typ.

V2

0°

8°

0°

8°

Figure 14. D2PAK footprint (dimensions in mm)

16.90

10.30

8.90

5.08

1.30

3.70

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

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