RL56CSMV/6-35LP Просмотр технического описания (PDF) - Conexant Systems

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RL56CSMV/6-35LP

AnyPort™ Multi-Service Access Processor

Conexant Systems 

5/&609

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Product Thermal Performance

For multi-die packages, an equivalent thermal resistance is used to represent thermal performance. This definition is used to

evaluate thermal performance of the package directly in a system level situation. The defined equivalent thermal resistance is

only valid at the stated power conditions.

Junction Temperature Calculation for Package Type: 35 mm BGA, Size = 35.0 mm * 35.0 mm * 2.27 mm

Maximum junction temperature can be calculated as:

Tj = P × θ ja + Ta

(1)

Where:

θ ja = Equivalent Package Thermal Resistance (°C/W)

T = Maximum Junction Temperature (°C)

j

T = Ambient Temperature (°C)

a

P = Package Total Power Dissipation Value (W)

For this product:

P = 1.54 (W)

θ ja = 21.30 °C/W (natural convection)

θ ja = 16.50 °C/W (1 m/s air flow)

From equation (1) and assuming maximum ambient temperature of 70 °C, maximum junction temperature for the natural

convection case is calculated as:

T

j

=

1.54

×

21.30

+

70

=

102.80

°C

Test Structure

Package thermal performance has been tested following JEDEC standards. The BGA package has been mounted at the

center of a 100 mm x 100 mm 6-layer test board and has been tested under different air flow velocities. Figure 4 shows the

system configuration.

Air Flow

LP

A

LP

B

A= 100 mm, B = 100 mm , LP= 2.27 mm and L B= 1.50 mm

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Conexant

100467E

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