SGM2008 Просмотр технического описания (PDF) - Shengbang Microelectronics Co, Ltd
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SGM2008 Datasheet PDF : 10 Pages
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ORDERING INFORMATION
MODEL
SGM2008-1.8
SGM2008-2.5
SGM2008-2.7
SGM2008-2.8
SGM2008-2.85
SGM2008-2.9
SGM2008-3.0
SGM2008-3.3
SGM2008-3.6
VOUT(V)
1.8V
2.5V
2. 7V
2.8V
2.85V
2.9V
3.0V
3.3V
3.6V
PIN-
PACKAGE
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SPECIFIED
TEMPERATURE
RANGE
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
ORDERING
NUMBER
SGM2008-1.8XN5/TR
SGM2008-2.5XN5/TR
SGM2008-2. 7XN5/TR
SGM2008-2.8XN5/TR
SGM2008-2.85XN5/TR
SGM2008-2.9XN5/TR
SGM2008-3.0XN5/TR
SGM2008-3.3XN5/TR
SGM2008-3.6XN5/TR
PACKAGE
MARKING
X818
X825
X827
X828
X82J
X829
X830
X833
X836
PACKAGE
OPTION
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
ABSOLUTE MAXIMUM RATINGS
IN to GND.....................................................................- 0.3V to +6V
Output Short-Circuit Duration ...........................................Infinite
EN to GND.................................................................- 0.3V to +6V
OUT, BP to GND......................................- 0.3V to (VIN + 0.3V)
Power Dissipation, PD @ TA = 25℃
SOT23-5 .....................................................................................0.4W
Package Thermal Resistance
SOT23-5, θJA....................................................................... 250℃/W
Operating Temperature Range...........................- 40°C to +125°C
Junction Temperature...........................................................+150°C
Storage Temperature.............................................- 65°C to +150°C
Lead Temperature (soldering, 10s).......................................260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
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SGM2008
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