8574TS Просмотр технического описания (PDF) - Philips Electronics

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8574TS

Remote 8-bit I/O expander for I2C-BUS

Philips Electronics 

Philips Semiconductors

Remote 8-bit I/O expander for I2C-bus

Product specification

PCF8574

13.4 Suitability of IC packages for wave, reflow and dipping soldering methods

MOUNTING

PACKAGE(1)

SOLDERING METHOD

WAVE

REFLOW(2) DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

suitable(3)

−

suitable

Surface mount

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable

suitable

−

HBCC, HBGA, HLQFP, HSQFP, HSOP,

HTQFP, HTSSOP, HVQFN, HVSON, SMS

not suitable(4)

suitable

−

PLCC(5), SO, SOJ

suitable

suitable

−

LQFP, QFP, TQFP

not recommended(5)(6) suitable

−

SSOP, TSSOP, VSO

not recommended(7) suitable

−

Notes

1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2002 Nov 22

21

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