PCD6003 Просмотр технического описания (PDF) - Philips Electronics

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PCD6003

Digital telephone answering machine chip

Philips Electronics 

Philips Semiconductors

Digital telephone answering machine chip

Product specification

PCD6003

CONTENTS

12

1

FEATURES

12.1

12.2

2

APPLICATION SUMMARY

2.1

Metalink emulation

13

3

GENERAL DESCRIPTION

13.1

4

ORDERING INFORMATION

13.2

5

BLOCK DIAGRAM

14

6

PINNING INFORMATION

14.1

6.1

Pinning

14.2

6.2

Pin description

15

6.3

Pin types

15.1

7

FUNCTIONAL DESCRIPTION

15.2

7.1

Architecture

15.3

7.2

I/O summary

15.4

7.3

Overview of functional description

15.5

15.6

8

POWER SUPPLY, RESET AND START-UP

16

8.1

Power supply

8.2

Reset and start-up

16.1

16.2

9

TICB - GENERATION AND SELECTION OF

SYSTEM CLOCKS

17

9.1

Microprocessor, DSP, CODEC and IOM clock 17.1

generation

17.2

9.2

System clocks

17.3

9.3

Real-Time Clock generation

17.4

10

10.1

10.2

10.3

10.4

10.5

10.6

10.7

10.8

10.9

10.10

10.11

10.12

10.13

11

11.1

THE MICROCONTROLLER

17.5

Microcontroller architecture

18

Memory mapping

SFR mapping

19

Microcontroller interrupts

20

Interface to DSP

20.1

Interface to Real-Time Clock (RTC)

Interface to the Memory Control Block (MCB) 20.2

The test registers CDTRx, PMTRx and TCTRL 20.3

Interface to Timing and Control Block (TICB) 20.4

Power and Interrupt Control Register (PCON) 20.5

I2C-bus

MSK modem

LE control

21

DSP I/O REGISTERS

22

Interface to CODEC

23

24

EXTERNAL MEMORY INTERFACE

Supported flash memories

DTAM external interface during target

debugging

THE CODECs

Definitions

CODEC architecture

ANALOG VOLTAGE REFERENCE (AVR)

Bandgap reference

Analog Voltage Source (AVS)

IOM

Features

Pin description

Functional description

IOM data buffers

IOM Control Register (IOMC)

Timing

EXTERNAL I/O INTERFACES

External analog interfaces

External digital Interfaces

ELECTRICAL CHARACTERISTICS

Limiting values

Supply characteristics

Digital I/O

Analog supplies and general purpose ADC and

DAC

CODECs

APPLICATION DIAGRAMS

PACKAGE OUTLINE

SOLDERING

Introduction to soldering surface mount

packages

Reflow soldering

Wave soldering

Manual soldering

Suitability of surface mount IC packages for

wave and reflow soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PURCHASE OF PHILIPS I2C COMPONENTS

2001 Apr 17

2

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