W91550DNH-1 Просмотр технического описания (PDF) - Winbond
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W91550DNH-1 Datasheet PDF : 32 Pages
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W91550DN SERIES
BONDING PAD DIAGRAM
2 1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
3
47
4
46
5
45
6
44
7
8
43
(0, 0)
9
42
10
41
11
40
12
39
13
38
14
37
15
36
16
17
35
18
19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
34
Notes:
1. The substrate must be connected to VSS.
2. The chip size is 3010.00 × 3060.00 µm2
PAD
NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PAD
NAME
KMUTE
COM3
1A
1B
1C
2A
2B
2C
3A
3B
3C
4A
4B
4C
5A
5B
X
-1234.60
-1374.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
-1359.60
Y
1369.20
1322.70
1052.80
905.20
741.40
593.80
430.00
282.40
118.60
-29.00
-192.80
-340.40
-504.20
-651.80
-810.80
-963.20
PAD
NO.
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PAD
NAME
5C
6A
6B
6C
7A
7B
7C
8A
8B
S/ M
8C
9A
9B
9C
10A
10B
Unit: µm
X
Y
-1359.60
-1359.60
-1117.60
-970.00
-811.00
-658.60
-494.80
-342.40
-183.40
-28.90
128. 00
280.40
439.40
587.00
746.00
898.40
-1127.00
-1281.50
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
-1384.60
- 31 -
Publication Release Date: November 1997
Revision A3
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