MSM9841 Просмотр технического описания (PDF) - Oki Electric Industry

Номер в каталоге

Компоненты Описание

Список матч

MSM9841

Recording and Playback LSI with Built-in FIFO

Oki Electric Industry 

¡ Semiconductor

PACKAGE DIMENSIONS

QFP56-P-910-0.65-2K

FEDL9841-04

MSM9841

(Unit : mm)

Mirror finish

Package material

Lead frame material

Pin treatment

Oki Electric Industry Co., Ltd.

Package weight (g)

Rev. No./Last Revised

Notes for Mounting the Surface Mount Type Package

Epoxy resin

42 alloy

Solder plating (≥5 mm)

0.43 TYP.

4/Nov. 28, 1996

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type

packages, which are very susceptible to heat in reflow mounting and humidity absorbed in

storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person

on the product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

8/9

Share Link: