FEDR27V802F-01-03 Просмотр технического описания (PDF) - Oki Electric Industry

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Компоненты Описание

Список матч

FEDR27V802F-01-03

524,288–Word x 16–Bit or 1,048,576–Word x 8–Bit One Time PROM

Oki Electric Industry 

OKI Semiconductor

PACKAGE DIMENSIONS

SOP44-P-600-1.27-K

FEDR27V802F-01-03

MR27V802F / OTP

(Unit: mm)

Mirror finish

5

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (≥5µm)

2.10 TYP.

4/Dec. 5, 1996

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in

storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,

package name, pin number, package code and desired mounting conditions (reflow method, temperature and

times).

11/15

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