MPX2010 MPXV2010G SERIFErSeescale Semiconductor, Inc.
SMALL OUTLINE PACKAGE DIMENSIONS—CONTINUED
2 PLACES 4 TIPS
0.006 (0.15) C A B
A
E
e
5
4
e/2
D
GAGE
PLANE
.014 (0.35) θ
8
F
B
E1
N
1
8X b
0.004 (0.1) M C A B
STYLE 1:
PIN 1. GND
2. +Vout
3. Vs
4. -Vout
5. N/C
6. N/C
7. N/C
8. N/C
STYLE 2:
PIN 1. N/C
2. Vs
3. GND
4. Vout
5. N/C
6. N/C
7. N/C
8. N/C
∅T
A
M
8X 0.004 (0.1)
P
K
DETAIL G
C
SEATING
PLANE
CASE 1351–01
ISSUE O
L
A1
DETAIL G
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M-1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.008 (0.203) MAXIMUM.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.370 0.390 9.39 9.91
A1 0.002 0.010 0.05 0.25
b 0.038 0.042 0.96 1.07
D 0.465 0.485 11.81 12.32
E 0.680 0.700 17.27 17.78
E1 0.465 0.485 11.81 12.32
e
0.100 BSC
2.54 BSC
F 0.240 0.260 6.10 6.60
K 0.115 0.135 2.92 3.43
L 0.040 0.060 1.02 1.52
M 0.270 0.290 6.86 7.37
N 0.160 0.180 4.06 4.57
P 0.009 0.011 0.23 0.28
T 0.110 0.130 2.79 3.30
θ
0°
7°
0°
7°
6
For More Information On This Product, Motorola Sensor Device Data
Go to: www.freescale.com