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MP3275 Просмотр технического описания (PDF) - Exar Corporation

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MP3275 Datasheet PDF : 16 Pages
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MP3275
ELECTRICAL CHARACTERISTICS TABLE (CONT’D)
Description
25°C
Tmin to Tmax
Symbol Min Typ Max Min Max
Units
DIGITAL OUTPUTS
(Data Format 2’s Complement)
SDO, STS, STL
Logical “1” Voltage
Logical “0” Voltage
Tristate Leakage
POWER SUPPLIES
VOH
4.0
VOL
IOZ
–5
2.4
V
0.4
0.4 V
5
–5
5 µA
Operating Range
VDD
VCC
VEE
Operating Current
IDD
ICC
IEE
Power Dissipation
+4.5
+11.4
–4.75
+5.5
+16.5
–16.5
2
7
5
8
1.5
3
110 200
+4.5
+11.4
–4.75
+5.5 V
+16.5 V
–16.5 V
7 mA
8 mA
3 mA
200 mW
Conditions
COUT=15 pF
ISOURCE = 0.5 mA
ISINK = 1.6 mA
VOUT=GND to VDD
Tested at –11.4 and –16.5 only
NOTES
1 Tester measures code transitions by dithering the voltage of the analog input (VIN). The difference between the measured and the
ideal code width is the DNL error. The INL error is the maximum distance (in LSB’s) from the best fit line to any transition voltage
2 Guaranteed. Not tested.
3 All channel input pins and ground reference pin have protection which becomes active above 60 V.
4 All digital inputs have diodes to VDD and AGND. Input DC currents will not exceed specified limits for any input voltage between
AGND and VDD.
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted)1, 2
VCC to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to +16.5 V
VEE to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to –16.5 V
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 V
Digital Inputs or Outputs (WR, RD, CS, AB0-AB4, ADEN,
SDC) to DGND . . . . . . . . . . . . . . . . . . –0.5 V to VDD +0.5 V
Analog Inputs (AIN0 – AIN15, GND REF)
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±60 V
REF OUT . . . . . . . . . . . . . . . . . . . Indefinite short to DGND,
Momentary short to VCC
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150°C
Package Power Dissipation Rating to 75°C
PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750 mW
Derates above 75°C . . . . . . . . . . . . . . . . . . . . . 10 mW/°C
Lead Temperature, Soldering . . . . . . . . . . . . 300°C, 10 Sec
Storage Temperature (Ceramic) . . . . . . . . –65°C to +150°C
NOTES:
1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies. All logic inputs have protection diodes which will protect the device from
short transients outside the supplies of less than 100mA for less than 100µs.
Rev. 4.00
5

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