ML7012-04 Просмотр технического описания (PDF) - Oki Electric Industry

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ML7012-04

2400 bps Single Chip Full Duplex Data Modem with Protocol

Oki Electric Industry 

1Semiconductor

PACKAGE DIMENSIONS

QFP64-P1414-0.80-BK

FEDL 7012-04-01

ML7012-04

(Unit: mm)

5

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (≥5µm)

0.87 TYP.

5/Sept.21,1999

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product

name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).

21/22

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