MCS0402AT(2009) Просмотр технического описания (PDF) - Vishay Semiconductors

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MCS0402AT
(Rev.:2009)

Professional Thin Film Chip Resistor Superior Moisture Resistivity

Vishay Semiconductors 

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional

Professional Thin Film Chip Resistor

Superior Moisture Resistivity

Vishay Beyschlag

DIMENSIONS

W WT

H

T2

T1

L

DIMENSIONS AND MASS

TYPE

H

(mm)

L

(mm)

MCS 0402 AT 0.32 ± 0.05

1.0 ± 0.05

MCT 0603 AT 0.45 + 0.1/- 0.05 1.55 ± 0.05

MCU 0805 AT

0.52 ± 0.1

2.0 ± 0.1

MCA 1206 AT

0.55 ± 0.1

3.2 + 0.1/- 0.2

W

(mm)

0.5 ± 0.05

0.85 ± 0.1

1.25 ± 0.15

1.6 ± 0.15

SOLDER PAD DIMENSIONS

WT

(mm)

> 75 % of W

> 75 % of W

> 75 % of W

> 75 % of W

T1

(mm)

0.2 + 0.1/- 0.15

0.3 + 0.15/- 0.2

0.4 + 0.1/- 0.2

0.5 ± 0.25

T2

(mm)

0.2 ± 0.1

0.3 + 0.15/- 0.2

0.4 + 0.1/- 0.2

0.5 ± 0.25

MASS

(mg)

0.6

1.9

4.6

9.2

G

X

Y

Z

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE

G

(mm)

WAVE SOLDERING

Y

(mm)

X

(mm)

Z

(mm)

G

(mm)

REFLOW SOLDERING

Y

(mm)

X

(mm)

Z

(mm)

MCS 0402 AT

-

-

-

-

0.35

0.55

0.55

1.45

MCT 0603 AT

0.55

1.10

1.10

2.75

0.65

0.70

0.95

2.05

MCU 0805 AT

0.80

1.25

1.50

3.30

0.90

0.90

1.40

2.70

MCA 1206 AT

1.40

1.50

1.90

4.40

1.50

1.15

1.75

3.80

Note

• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of

power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain the

reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.

The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in

publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other

parameters.

Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.

Please note however that applications for “power operation mode” or “advanced temperature mode” require special considerations for the

design of solder pads and adjacent conductor areas.

Document Number: 28760

Revision: 07-Dec-09

For technical questions, contact: thinfilmchip@vishay.com

www.vishay.com

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