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MC14513BCP(2000) Просмотр технического описания (PDF) - ON Semiconductor

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MC14513BCP
(Rev.:2000)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC14513BCP Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
18
1
A
F
D
H
G
MC14513B
PACKAGE DIMENSIONS
PDIP–18
P SUFFIX
PLASTIC DIP PACKAGE
CASE 707–02
ISSUE C
J
10
B
L
9
M
C
NK
SEATING
PLANE
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.875 0.915
B 0.240 0.260
C 0.140 0.180
D 0.014 0.022
F 0.050 0.070
G 0.100 BSC
H 0.040 0.060
J 0.008 0.012
K 0.115 0.135
L
0.300 BSC
M
0_ 15_
N 0.020 0.040
MILLIMETERS
MIN MAX
22.22 23.24
6.10 6.60
3.56 4.57
0.36 0.56
1.27 1.78
2.54 BSC
1.02 1.52
0.20 0.30
2.92 3.43
7.62 BSC
0 _ 15_
0.51 1.02
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