datasheetbank_Logo
Технический паспорт Поисковая и бесплатно техническое описание Скачать

MC100E150 Просмотр технического описания (PDF) - ON Semiconductor

Номер в каталоге
Компоненты Описание
Список матч
MC100E150
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC100E150 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
MC10E150, MC100E150
Table 6. 100E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = −5.0 V (Note 7)
0°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 8)
VOL
Output LOW Voltage (Note 8)
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIH
Input HIGH Current
D
LEN, MR
52
62
52
62
60
72 mA
−1025 −950 −880 −1025 −950 −880 −1025 −950 −880 mV
−1810 −1705 −1620 −1810 −1745 −1620 −1810 −1740 −1620 mV
−1165 −1025 −880 −1165 −1025 −880 −1165 −1025 −880 mV
−1810 −1645 −1475 −1810 −1645 −1475 −1810 −1645 −1475 mV
200
200
200 mA
150
150
150 mA
IIL
Input LOW Current
0.5 0.3
0.5 0.25
0.5 0.2
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V.
8. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
Table 7. AC CHARACTERISTICS VCCx= 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 9)
0°C
25°C
85°C
Symbol
fMAX
tPLH
tPHL
Characteristic
Maximum Toggle Frequency
Propagation Delay to Output
D
LEN
MR
Min Typ Max Min Typ Max Min Typ Max Unit
900 1100
900 1100
900 1100
MHz
ps
250 375 550 250 375 550 250 375 550
375 500 800 375 500 800 375 500 800
450 625 750 450 625 750 450 625 750
ts
Setup Time
D
ps
200 50
200 50
200 50
th
Hold Time
D
ps
200 −50
200 −50
200 −50
tRR
Reset Recovery Time
tPW
Minimum Pulse Width
MR
750 650
750 650
750 650
ps
ps
400
400
400
tSKEW
tJITTER
tr
tf
Within-Device Skew (Note 10)
Random Clock Jitter (RMS)
Rise/Fall Time
(20 - 80%)
50
50
50
ps
<1
<1
<1
ps
ps
300 450 650 300 450 650 300 450 650
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: VEE can vary −0.46 V / +0.06 V.
100 Series: VEE can vary −0.46 V / +0.8 V.
10. Within-device skew is defined as identical transitions on similar paths through a device.
http://onsemi.com
5

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]