MAS9276 Просмотр технического описания (PDF) - Micro Analog systems
Номер в каталоге
Компоненты Описание
Список матч
MAS9276 Datasheet PDF : 8 Pages
| |||
DA9276.003
13 July, 2006
SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
P1
P2
PO
DO
E
WF
T
BO
A
AO
D1
User Direction of Feed
KO
Section A-A
Dimension
Ao
Bo
Do
D1
E
F
Ko
Po
P1
P2
T
W
Pin 1 Designator
Min/Max
5.00 ±0.10
3.20 ±0.10
1.50 +0.1/-0.0
1.50 min
1.75
5.50 ±0.05
1.45 ±0.10
4.0
8.0 ±0.10
2.0 ±0.05
0.3 ±0.05
12.00 +0.30/-0.10
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
6 (8)
Share Link: 