MAS9270 Просмотр технического описания (PDF) - Micro Analog systems

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MAS9270

IC FOR 10.00 – 30.00 MHz VCTCXO

Micro Analog systems 

DA9270.008

11 September 2006

SOLDERING INFORMATION

N For Sn/Pb MSOP-10

Resistance to Soldering Heat

Maximum Temperature

Maximum Number of Reflow Cycles

Reflow profile

Seating Plane Co-planarity

Lead Finish

According to RSH test IEC 68-2-58/20 2*220°C

240°C

2

Thermal profile parameters stated in JESD22-A113 should not

be exceeded. http://www.jedec.org

max 0.08 mm

Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%

N For Pb Free, RoHS Compliant MSOP-10

Resistance to Soldering Heat

Maximum Temperature

Maximum Number of Reflow Cycles

Reflow profile

Lead Finish

According to RSH test IEC 68-2-58/20

260°C

3

Thermal profile parameters stated in IPC/JEDEC J-STD-020

should not be exceeded. http://www.jedec.org

Solder plate 7.62 - 25.4 µm, material Matte Tin

6 (9)

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