MAS1016B Просмотр технического описания (PDF) - Micro Analog Systems Oy
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MAS1016B Datasheet PDF : 10 Pages
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SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
DA1016B.001
27 January, 2004
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
P0
D0
P2
Tape Feed Direction
A
E1
F1
W
P
T
Section A - A
D1
A
A0
Tape Feed Direction
B0
S1
Dimension
A0
B0
D0
D1
E1
F1
K0
P
P0
P2
S1
T
W
K0
Pin 1 Designator
Min
6.50
5.20
1.50
1.65
7.20
1.20
11.90
1.95
0.6
0.25
11.70
1.50 +0.10 / -0.00
4.0
Max
6.70
5.40
1.85
7.30
1.40
12.10
2.05
0.35
12.30
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
8 (10)
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