MAPCGM0005-DIE Просмотр технического описания (PDF) - Tyco Electronics
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MAPCGM0005-DIE Datasheet PDF : 7 Pages
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6-Bit Digital Phase Shifter
RFIN
100 pF
RO-P-DS-3053 - - 7/7
MAPCGM0005-DIE
0.1 μF
VDD
CONTROL
INPUTS
GND :G
GND: G
GND: G
G ND:G
i
d
=
S
=10=8820
W
i
d
=SW5=08=
12
idS=W=2 =85 8
G ND:G
GND: G
RFOUT
Figure 8. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach: Low thermal conductivity silver epoxies are acceptable for die attach of this MMIC. Follow the
manufacturer’s instructions. If solder is employed , use AuSn (80/20) 1-2 mil preform solder. Limit time @
300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC and RF pad connections, use either ball or wedge bonds. For best performance, especially above 10
GHz, wedge bonds of shortest length employed on the RF interconnects is preferred over ball bonds.
Biasing Note: Must apply negative bias to VEE before applying positive bias to Control Pads.
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product informVat1io.0n0.
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