MAR7001CC Просмотр технического описания (PDF) - Dynex Semiconductor

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MAR7001CC

Radiation Hard 512x9 Bit FIFO

Dynex Semiconductor 

MA7001

Figure 12: Depth Expansion Mode (1024 x 9 bits)

Compound Expansion Mode:

Both width and depth expansion can be implemented into the

same expansion block. Note that no control signals are in

conflict in either of the two expansion modes, i.e. width or

depth expansion modes. Utilising compound expansion large

FIFO arrays are possible. Figure 13 illustrates the use of

compound expansion.

Bidirectional Mode:

The FIFO is a unidirectional device, i.e. one system reads,

another writes. In cases where full communication is required

between two or more systems, two or more groups of devices

can be used. These groups can utilise any or all of the

expansion modes already mentioned. Figure 14 illustrates 2

systems connected so that each can transmit data to and

recieve data from each other, (see Modes of Operation for

connection of control and data signals).

Figure 13: Compound Expansion

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