LTC1338 Просмотр технического описания (PDF) - Linear Technology
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LTC1338 Datasheet PDF : 8 Pages
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PACKAGE DESCRIPTIO Dimensions in inches (millimeters) unless otherwise noted.
LTC1338
G Package
28-Lead SSOP
0.205 – 0.212*
(5.20 – 5.38)
0.005 – 0.009 0.022 – 0.037
(0.13 – 0.22) (0.55 – 0.95)
0° – 8°
0.0256
(0.65)
BSC
0.010 – 0.015
(0.25 – 0.38)
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).
0.068 – 0.078
(1.73 – 1.99)
0.002 – 0.008
(0.05 – 0.21)
0.397 – 0.407*
(10.07 – 10.33)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
0.045
(1.14)
0.301 – 0.311
(7.65 – 7.90)
1 2 3 4 5 6 7 8 9 10 11 12 13 14
0.045
(1.14)
N Package
28-Lead Plastic DIP
0.600 – 0.625
(15.240 – 15.875)
0.009 – 0.015
(0.229 – 0.381)
+0.025
0.625 –0.015
( ) 15.87
+0.635
–0.381
0.130 ± 0.005
(3.302 ± 0.127)
0.015
(0.381)
MIN
0.045 – 0.065
(1.143 – 1.651)
0.125
(3.175)
MIN
0.035 – 0.080
(0.889 – 2.032)
0.100 ± 0.010
(2.540 ± 0.254)
0.018 ± 0.003
(0.457 ± 0.076)
0.070
(1.778)
TYP
1.455
(36.957)
MAX
28 27 26 25 24 23 22 21 20 19 18 17 16 15
0.505 – 0.560
(12.827 – 14.224)
1 2 3 4 5 6 7 8 9 10 11 12 13 14
S Package
28-Lead SOL
0.005
(0.127)
RAD MIN
0.291 – 0.299
(7.391 – 7.595)
(NOTE 2)
0.010
(0.254
–
–
0.029
0.737)
×
45°
0.093 – 0.104
(2.362 – 2.642)
0° – 8° TYP
0.009 – 0.013
(0.229 – 0.330) NOTE 1
0.016 – 0.050
(0.406 – 1.270)
0.050
(1.270)
TYP
0.014 – 0.019
(0.356 – 0.482)
NOTE:
1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS.
2. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).
0.037 – 0.045
(0.940 – 1.143)
0.697 – 0.712
(17.70 – 18.08)
(NOTE 2)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
NOTE 1
0.004 – 0.012
(0.102 – 0.305)
0.394 – 0.419
(10.007 – 10.643)
1 2 3 4 5 6 7 8 9 10 11 12 13 14
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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