CS8127 Просмотр технического описания (PDF) - Cherry semiconductor
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CS8127 Datasheet PDF : 6 Pages
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Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
Lead Count
8L PDIP
8L SO Narrow
Metric
Max Min
10.16 9.02
5.00 4.80
D
English
Max Min
.400 .355
.197 .189
Thermal Data
RQJC
typ
RQJA
typ
8 Lead
PDIP
52
100
8 Lead
SO Narrow
45
165
ûC/W
ûC/W
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
3.68 (.145)
2.92 (.115)
8.26 (.325)
7.62 (.300)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
REF: JEDEC MS-001
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
D
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
Surface Mount Narrow Body (D); 150 mil wide
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
1.57 (.062)
1.37 (.054)
REF: JEDEC MS-012
1.75 (.069) MAX
0.25 (0.10)
0.10 (.004)
D
Ordering Information
Part Number
CS8127YN8
CS8127YD8
CS8127YDR8
Description
8 Lead PDIP
8 Lead SO Narrow
8 Lead SO Narrow (tape & reel)
Rev. 2/12/99
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
6
© 1999 Cherry Semiconductor Corporation
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