M36W216TI70ZA1T Просмотр технического описания (PDF) - STMicroelectronics

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M36W216TI70ZA1T

16 Mbit 1Mb x16 / Boot Block Flash Memory and 2 Mbit 128Kb x16 SRAM / Multiple Memory Product

STMicroelectronics 

M36W216TI, M36W216BI

PACKAGE MECHANICAL

Figure 7. Stacked LFBGA66-12x8mm, 8x8 ball array, 0.8mm pitch, Bottom View Package Outline

D

D2

D1

SE

b

E E1

BALL "A1"

e

ddd

FE

FD

SD

e

A

A2

A1

BGA-Z12

Note: Drawing is not to scale.

Table 7. Stacked LFBGA66 - 12x8mm, 8x8 ball array, 0.8 mm pitch, Package Mechanical Data

Symbol

millimeters

Typ

Min

Max

inches

Typ

Min

Max

A

1.400

0.0551

A1

0.300

0.0118

A2

1.100

0.0433

b

0.400

0.300

0.500

0.0157

0.0118

0.0197

D

12.000

–

–

0.4724

–

–

D1

5.600

–

–

0.2205

–

–

D2

8.800

–

–

0.3465

–

–

ddd

0.100

0.0039

E

8.000

–

–

0.3150

–

–

E1

5.600

–

–

0.2205

–

–

e

0.800

–

–

0.0315

–

–

FD

1.600

–

–

0.0630

–

–

FE

1.200

–

–

0.0472

–

–

SD

0.400

–

–

0.0157

–

–

SE

0.400

–

–

0.0157

–

–

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