MRFIC1813 Просмотр технического описания (PDF) - Motorola => Freescale
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MRFIC1813 Datasheet PDF : 8 Pages
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f
(MHz)
70
100
150
200
250
300
350
IF Input
R
jX
8.3
–452.4
7.3
–318.5
7.1
–211.3
6.6
–156.4
6.5
–123.1
6.1
–100.7
5.7
–84.2
LO Input
R
jX
RF Output (1)
R
jX
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
(1) Includes T1 shown in Figure 1.
62.5
3.1
58.1
4.3
53.7
4.7
50.2
4.2
47.3
3.9
44.4
3.2
42.0
1.6
30.4
33.6
40.6
0.5
42.6
16.9
39.6
–0.7
49.1
2.3
38.7
–2.2
40.6
14.2
38.2
–3.6
33.8
17.7
38.4
–5.1
33.3
15.7
38.9
–6.5
32.9
13.7
39.5
–7.8
29.6
13.2
27.4
11.9
Table 1. Port Impedances versus Frequency
(VD1, VD2, VD3, TX EN = 3 Vdc)
APPLICATIONS INFORMATION
DESIGN CONSIDERATIONS
The MRFIC1813 combines a single–balanced MESFET
mixer with an exciter amplifier. It is usable for transmit fre-
quencies from 1.7 to 2.5 GHz and IF frequencies from 70 to
350 MHz. The design is optimized for low–side local oscilla-
tor injection in hetrodyne transmit applications.
Minimal off–chip matching is required while allowing for
flexibility and performance optimization. An active balun is
employed at the IF port which gives good balance down to at
least 70 MHz. A passive splitter is used at the LO input to
complete the single–balanced configuration.
CIRCUIT CONSIDERATIONS
Figure 1 shows the application circuit used to gather the
data presented in the characterization curves. As shown in
Table 1, the IF port impedance is very high. Three hundred
ohms was chosen for R1 to shunt the IF port as a compro-
mise of gain and bandwidth. A 50 Ω resistor can be used and
L1 and C5 eliminated to provide a broadband match. The
conversion gain is reduced to about 8 dB. Microstrip induc-
tors T1 and T2 combine with inductance internal to the de-
vice to form RF chokes. Some tuning of the RF output can be
achieved with T1.
As with all RF devices, circuit layout is important. Con-
trolled impedance lines should be used for all RF and IF in-
terconnects. As shown in Figure 1, power supply by–passing
should be used to avoid device instability. Ground vias
should be included near all ground connections indicated in
the schematic. Off–chip components should be mounted as
close to the IC leads as possible.
EVALUATION BOARDS
Evaluation boards are available for RF Monolithic Inte-
grated Circuits by adding a “TF” to the device type. For a
complete list of currently available boards and one in devel-
opment for newly introduced products, please contact your
local Motorola Distributor or Sales Office.
MRFIC1813
6
MOTOROLA RF DEVICE DATA
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