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LX5552LU

2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SPDT Switch

Microsemi Corporation 

LX5552

TM

® 2.4-2.5 GHz Front-End Module with Internally

Matched Power Amplifier, LNA & SPDT Switch

PRODUCTION DATA SHEET

PRODUCT HIGHLIGHT

MSC

5552

81480A

PACKAGE ORDER INFO

Plastic MLPQ

16 pin 3x3mm

LU RoHS Compliant /Pb-Free

LX5552LU

Note: Available in Tape & Reel.

Append the letters “TR” to the part number.

(i.e. LX5552LU-TR)

ABSOLUTE MAXIMUM RATINGS

DC Supply Voltage, RF off (PA).......................................................................5V

(LNA) ...................................................................4V

(Switch) ................................................................5V

Collector Current (PA)................................................................................500mA

Drain Current (LNA) ....................................................................................40mA

Total Power Dissipation....................................................................................2W

RF Input Power (With 50 Ohm Load at Output) ......................................+10dBm

Maximum Junction Temperature (Tj max) ................................................ +150°C

Operation Ambient Temperature ...................................................-40°C to +85°C

Storage Temperature....................................................................-65°C to +150°C

RoHS/Pb-Free Peak Package Temp. for Solder Reflow

(40 seconds maximum exposure)................................................... 260°C (+0, -5)

Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to

Ground. Currents are positive into, negative out of specified terminal.

THERMAL DATA

LU Plastic MLPQ 16-Pin

THERMAL RESISTANCE-JUNCTION TO CASE, θJC

THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA

9.5 C/W

50.0 C/W

Junction Temperature Calculation: TJ = TA + (PD x θJA).

The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the

above assume no ambient airflow.

PACKAGE PIN OUT

TxIn NC Vc1 NC

Vcc

Vref

Det

RxOut

16 15 14 13

1

12

2

11

3

10

GND

4

9

5678

Vc2

PAOut

SwIn

NC

Vdd CtrlRx Ant CtrlTx

LU PACKAGE

(“See-Through” View from Top)

RoHS/Pb-Free 100% Matte Tin Lead finish

Copyright © 2009

Rev. 1.0, 2009-06-02

Microsemi

Analog Mixed Signal Group

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

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