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LX1675

Multiple Output LoadSHARE™ PWM

Microsemi Corporation 

LX1675

TM

®

Multiple Output LoadSHARE™ PWM

PRODUCTION DATA SHEET

ABSOLUTE MAXIMUM RATINGS

Supply Voltage (VIN, VSLR, HRX) ............................................................... -0.3V to 24V

Supply Voltage (VCCL) ................................................................................ -0.3V to 6.0V

Driver Supply Voltage (VCX) ........................................................................ -0.3V to 30V

Current Sense Inputs (CSX)............................................................................ -0.3V to 30V

Error Amplifier Inputs (FBX, RF2, LDFB) .................................................... -0.3V to 5.5V

Internal regulator Current (IVCCL)............................................................................... 50mA

Output Drive Peak Current Source (HOX, LOX) ................................................ 1A (200ns)

Output Drive Peak Current Sink (HOX, LOX) ................................................. 1.5A (200ns)

Differential Voltage: VHOX – VHRX (High Side Return) .................................... -0.3V to 6V

Soft Start Input (SSX, SSL) ............................................................................-0.3V to VREF

Logic Inputs (SF, FS)..........................................................................-0.3V to VCCL + 0.5V

LDO Gate Drive (LDGD) Output Drive can source .................................................. 10mA

LDO Feedback (LDFB) Input.......................................................................................6.0V

Operating Junction Temperature................................................................................ 150°C

Operating Temperature Range .......................................................................-40°C to 85°C

Storage Temperature Range.........................................................................-65°C to 150°C

Peak Package Solder Reflow Temp. (40 seconds maximum exposure) ......... 260°C (+0 -5)

Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to

Ground. Currents are positive into, negative out of specified terminal.

Limitations affecting transient pulse duration is thermally related to the clamping zener

diodes connected to the supply pins, application of maximum voltage will increase current

into that pin and increase power dissipation.

x denotes respective pin designator 1, 2, or 3.

THERMAL DATA

PACKAGE PIN OUT

LO2

HR2

HO2

VC2

CS2

SF

EO2

FB2

SS2

RF2

EO1

FB1

1 38 37 36 35 34 33 32 31

2

30

3

29

4

28

5

27

6 Connect Bottom to 26

7

Power GND

25

8

24

9

23

10

22

11

21

12 13 14 15 16 17 18 19 20

HR3

LO3

PG3

VCCL

VIN

CS1

DGND

CS3

FS

EO3

FB3

SS3

LQ PACKAGE

(Top View)

RoHS / Pb-free 100% Matte Tin Lead Finish

LQ Plastic MLPQ 38-Pin

THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA

30 to 55°C/W

Junction Temperature Calculation: TJ = TA + (PD x θJA).

The θJA numbers are dependent on heat spreading and layout considerations for the thermal

performance of the device/pc-board system. All of the above assume no ambient airflow.

Copyright © 2004

Rev. 1.2a, 2006-02-16

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

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