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LT5500EGN Просмотр технического описания (PDF) - Linear Technology

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LT5500EGN
Linear
Linear Technology Linear
LT5500EGN Datasheet PDF : 12 Pages
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LT5500
APPLICATIONS INFORMATION
Modes of Operation
The LT5500 has three operating modes:
1. Shutdown
2. LNA High Gain
3. LNA Low Gain
For shutdown, the EN pin and the GS pin must be at logic
Low. Logic Low is defined as a control voltage below 0.3V.
LNA High gain mode requires that both EN and GS pins be
at logic High. Logic High is defined as a control voltage
above 1.35V. LNA Low gain mode requires that the EN pin
be at logic High and that the GS pin be at logic Low. Mixer
operation is independent of the GS pin. The Mixer is
enabled when the EN pin is at logic High.
Table 1: Mode Selection
EN
GS
High
High
High
Low
Low
Low
LNA
High Gain
Low Gain
Shutdown
MIXER
On
On
Shutdown
Evaluation Board
Figure 6 shows the circuit schematic of the evaluation
board. Each signal terminal of the evaluation board has
provisions for three matching components in a T-forma-
tion. In practice, two or fewer components are needed to
achieve the match. In the case of the LNA input, no external
components are necessary if the band select filter pro-
vides the necessary AC coupling. Otherwise AC coupling
must be provided. A similar consideration applies to the
Mixer input pin. The LO terminal of the evaluation board
was designed to permit evaluation of both single ended
and differential matching configurations. The differential
configuration anticipates the use of a transformer. Simi-
larly, the IF output board layout was designed to permit
evaluation of both transformer based and discrete compo-
nent based matching.
The evaluation board employs primarily 0402 surface
mount components, particularly near the signal paths. All
surface mount inductors must have a high self-resonance
frequency. The component values necessary for 1.8GHz
and 2.5GHz applications are tabulated in Figure 3.
RF Layout Tips
• Use 50impedance transmission lines up to the match-
ing networks. Use of ground planes is a must, particu-
larly beneath the IC.
• Keep the matching networks as close to the pins as
possible.
• Surface mount 0402 outline (or smaller) parts are
recommended to minimize parasitic capacitances and
inductances.
• Improve LO isolation and maximize component density
by putting the LO signal trace on the bottom of the
board. This permits either the matching components or
an interstage filter to be placed directly between the
LNA output and the Mixer input.
• Place bypass capacitors to ground in close proximity to
the pull-up inductors on the LNA and Mixer outputs to
improve component behavior and assure a good small-
signal ground.
• VCC lines must be decoupled with low impedance,
broadband capacitors to prevent instability. The capaci-
tors should be placed as close as possible to the VCC
pins.
• Avoid use of long traces whenever possible. Long RF
traces in particular lead to signal radiation, degraded
isolation and higher losses.
5500f
9

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