LT3782AIFE(RevC) Просмотр технического описания (PDF) - Linear Technology

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LT3782AIFE
(Rev.:RevC)

2-Phase Step-Up DC/DC Controller

Linear Technology 

Package Description

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

FE Package

28-LeaFdEPPlacsktiacgTeSSOP (4.4mm)

28(-RLeefaerdenPcleaLsTtCicDTWSGSO# P05(-40.84-1m66m3)Rev K)

(Reference LETxCpoDsWedG P#a0d5-V0a8r-i1a6ti6o3nREeBv K)

Exposed Pad Variation EB

LT3782A

4.75

(.187)

9.60 – 9.80*

(.378 – .386)

4.75

(.187)

28 27 26 2524 23 22 21 20 1918 17 16 15

6.60 ±0.10

2.74

(.108)

4.50 ±0.10

SEE NOTE 4

0.45 ±0.05

EXPOSED

PAD HEAT SINK

ON BOTTOM OF

PACKAGE

1.05 ±0.10

0.65 BSC

RECOMMENDED SOLDER PAD LAYOUT

4.30 – 4.50*

(.169 – .177)

0.25

REF

0° – 8°

2.74

(.108)

6.40

(.252)

BSC

1 2 3 4 5 6 7 8 9 10 11 12 13 14

1.20

(.047)

MAX

0.09 – 0.20

(.0035 – .0079)

0.50 – 0.75

(.020 – .030)

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN MILLIMETERS

(INCHES)

3. DRAWING NOT TO SCALE

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

0.05 – 0.15

(.002 – .006)

FE28 (EB) TSSOP REV K 0913

For more information www.linear.com/LT3782A

3782afc

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