LT1175 Просмотр технического описания (PDF) - Linear Technology

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LT1175

500mA Negative Low Dropout Micropower Regulator

Linear Technology 

LT1175

Package Description

S8 Package

8-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

.050 BSC

.045 ±.005

.189 – .197

(4.801 – 5.004)

NOTE 3

8

7

6

5

.245

MIN

.160 ±.005

.228 – .244

(5.791 – 6.197)

.150 – .157

(3.810 – 3.988)

NOTE 3

.030 ±.005

TYP

RECOMMENDED SOLDER PAD LAYOUT

1

2

.010

(0.254

–

–

.020

0.508)

×

45°

.008 – .010

(0.203 – 0.254)

0°– 8° TYP

.053 – .069

(1.346 – 1.752)

.016 – .050

(0.406 – 1.270)

NOTE:

1. DIMENSIONS

IN

INCHES

(MILLIMETERS)

.014 – .019

(0.355 – 0.483)

TYP

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

34

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

SO8 0303

ST Package

3-Lead Plastic SOT-223

(Reference LTC DWG # 05-08-1630)

.248 – .264

(6.30 – 6.71)

.114 – .124

(2.90 – 3.15)

.059 MAX

.129 MAX

.264 – .287

(6.70 – 7.30)

.130 – .146

(3.30 – 3.71)

16

.0905

(2.30)

BSC

.071

(1.80)

MAX

.024 – .033

(0.60 – 0.84)

.181

(4.60)

BSC

.248 BSC

.039 MAX

.059 MAX

.033 – .041

(0.84 – 1.04)

.090

BSC

.181 MAX

RECOMMENDED SOLDER PAD LAYOUT

10° – 16°

10°

MAX

.010 – .014

(0.25 – 0.36)

.012

(0.31)

MIN

.0008 – .0040

(0.0203 – 0.1016)

10° – 16°

ST3 (SOT-233) 0502

1175fe

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