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G952T63T Просмотр технического описания (PDF) - Global Mixed-mode Technology Inc

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Компоненты Описание
Список матч
G952T63T
GMT
Global Mixed-mode Technology Inc GMT
G952T63T Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Global Mixed-mode Technology Inc.
G952
Absolute Maximum Ratings
(Note 1)
Input Voltage……………………………………..…..…7V
Power Dissipation Internally Limited…..
(Note 2)
Maximum Junction Temperature…..…………… …..150°C
Storage Temperature Range….…..-65°C TJ +150°C
Lead Temperature, Time for Wave Soldering
SOT 223 Package……………….……………..260°C, 4s
Continuous Power Dissipation (TA = +25°C)
SOT 89 (1)……………………...………………..…....0.5W
SOT 223(1)……………………...……………….…....0.8W
Operating Conditions
(Note 1)
Input Voltage…………………………………..2.7V~6.5V
Temperature Range……………………0°C TJ 125°C
Note (1): See Recommended Minimum Footprint
Electrical Characteristics
VIN =3.3V, IO = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER
CONDITIONS
MIN TYP
Output Voltage
Line Regulation
Load Regulation
Output Impedance
10mA < IO < 1A
3V < VIN < 6.5V, IO = 10mA
10mA < IO < 1A
200mA DC and 100mA AC, fo = 120Hz
1.764
1.800
3
30
80
Quiescent Current
Ripple Rejection
Dropout Voltage
Output Current
Short Circuit Current
VIN = 3.3V
fi = 120Hz,Vripple =1VP-P, Io = 100mA
IO = 0A
IO = 100mA
IO = 500mA
IO = 1A
Continuous Test,
TA = 25°C, TJ 150°C,
VOUT within ±2%
VIN = 3V(SOT 223)
VIN = 3.3V(SOT 223)
VIN = 3.3V(SOT 89)
Minimum footprint
(0.0625 square inch)
Mounted on 0.53
square inch pcb area
Mounted on 0.16
square inch pcb area
480
53
880
895
950
1160
660
1
0.5
1.6
Over Temperature
150
MAX
1.845
30
50
UNITS
V
mV
mV
m
µA
dB
mV
mA
A
A
A
°C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating
Conditions are conditions under which the device functions but the specifications might not be guaranteed. For
guaranteed specifications and test conditions see the Electrical Characteristics.
Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal re-
sistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem-
perature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC
will go into thermal shutdown. For the G952 in SOT 89 package. θJA is 250°C/W For the G952 in SOT 223
package, θJA is 156°C/W (See recommend minimum footprint). The safe operation in SOT 89, SOT 223
package, it can see “Typical Performance Characteristics” (Safe Operating Area).
Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4: The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the
regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value. Dropout
voltage is affected by junction temperature, load cur-
rent and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input
voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such
that average chip temperature is not significantly af-
fected.
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem-
perature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
Ver: 1.2
Dec 03, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
2

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