LIS331DL Просмотр технического описания (PDF) - STMicroelectronics
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LIS331DL
STMicroelectronics
LIS331DL Datasheet PDF : 42 Pages
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Mechanical and electrical specifications
2
Mechanical and electrical specifications
LIS331DL
2.1
Mechanical characteristics
Table 3. Mechanical characteristics @ Vdd=2.5 V, T= 25 °C unless otherwise noted(1)
Symbol
Parameter
Test conditions
Min. Typ.(2) Max.
Unit
FS
Measurement range(3)
FS bit set to 0
FS bit set to 1
±2.0
±2.3
g
±8.0
±9.2
So Sensitivity
FS bit set to 0
FS bit set to 1
16.2
18
19.8
mg/digit
64.8
72
79.2
TCSo
Sensitivity change vs
temperature
FS bit set to 0
±0.01
%/°C
TyOff
Typical zero-g level offset
accuracy(4),(5)
FS bit set to 0
FS bit set to 1
±40
mg
±60
mg
TCOff
Zero-g level change vs
temperature
Max delta from 25 °C
±0.5
mg/°C
NL Non linearity
Best fit straight line
±0.5
% FS
FS bit set to 0
STP bit used
X axis
-3
-19
-32
LSb
Vst
Self test output
change(6),(7),(8)
FS bit set to 0
STP bit used
Y axis
3
19
32
LSb
BW System bandwidth(9)
FS bit set to 0
STP bit used
Z axis
-3
-19
-32
LSb
ODR/2
Hz
Top Operating temperature range
-40
+85
°C
Wh Product weight
20
mgram
1. The product is factory calibrated at 2.5 V. The operational power supply range is from 2.16 V to 3.6 V.
2. Typical specifications are not guaranteed
3. Verified by wafer level test and measurement of initial offset and sensitivity
4. Typical zero-g level offset value after MSL3 preconditioning
5. Offset can be eliminated by enabling the built-in high pass filter
6. If STM bit is used values change in sign for all axes
7. Self Test output changes with the power supply. “Self test output change” is defined as OUTPUT[LSb](Self-test bit on CTRL_REG1=1)
-OUTPUT[LSb](Self-test bit on CTRL_REG1=0). 1LSb=4.6g/256 at 8bit representation, ±2.3 g Full-Scale
8. Output data reach 99% of final value after 3/ODR when enabling Self-Test mode due to device filtering
9. ODR is output data rate. Refer to Table 4 for specifications
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